8月7日，总部位于上海的华虹半导体有限公司在上交所科创板成功上市，募资212.03亿元，成为2023年迄今募集资金规模最大的A股IPO项目，也是仅次于中芯国际、百济神州的科创板史上第三大IPO项目。
通力律师事务所担任发行人律师，锦天城律师事务所则为联席保荐机构国泰君安、海通证券提供法律意见。
据悉，华虹半导体前身为中日合资成立于1997年的上海华虹NEC，经股权重组后，在港交所主板上市，本次系红筹国企回归A股科创板上市。
根据虎嗅资料，2004年，华虹转型生产智能卡芯片，并为当年中国第二代居民身份证内置的非接触式IC卡芯片代工，目前华虹半导体目前已经是全球最大的智能卡IC制造代工企业，以及国内最大的MCU制造代工企业。
此次募资将用于华虹制造（无锡）、8英寸厂优化升级、特色工艺技术创新研发、补充流动资金等多个项目。
锦天城团队由高级合伙人鲍方舟、王立、沈诚律师，以及合伙人陈炜、吴旭日律师领导。
Major Shanghai firms on the largest A-share IPO project by far this year
Shanghai-based Hua Hong Semiconductor successfully debuted on the STAR Market of the Shanghai Stock Exchange, raising $2.95 billion, making it the largest A-share IPO project in terms of funds raised so far in 2023. It is also the third-largest IPO project on the STAR Market, following only SMIC and BeiGene.
Llinks Law Offices acted as the issuer's legal counsel, while AllBright Law Offices provided legal advice to the joint sponsors Guotai Junan Securities and Haitong Securities.
Hua Hong Semiconductor, formerly known as Shanghai Hua Hong NEC, was a Sino-Japanese joint venture established in 1997. After equity restructuring, it went public on the Hong Kong Stock Exchange's main board. This listing marks the return of this red-chip state-owned enterprise to the A-share market.
In 2004, Hua Hong shifted to manufacturing smart card chips and was subcontracted to produce contactless IC chips for China's second-generation national ID cards that year. Currently, Hua Hong is the world's largest manufacturer of smart card ICs and the largest MCU manufacturer in China.
The funds raised will be used for multiple projects, including Hua Hong Manufacturing (Wuxi), optimization and upgrading of the 8-inch fab, innovative R&D for specialized process technology, and supplementing working capital.
The AllBright team was led by senior partners Bao Fangzhou, Wang Li, and Shen Cheng, as well as partners Chen Wei and Wu Xuri.
