近日，合肥晶合集成电路股份有限公司（晶合集成）于上海证券交易所科创板上市，募集资金总额约为人民币99.60亿元，成为今年截至目前规模最大的A股IPO。

金杜律师事务所担任发行人律师，海问律师事务所则为独家保荐人提供法律意见。

晶合集成成立于2015年，是中国大陆第三大、全球前十大的纯晶圆代工企业，主要从事12英寸晶圆代工业务，致力于研发并应用行业先进的工艺，为客户提供多种制程节点、不同工艺平台的晶圆代工服务。

金杜团队由合伙人刘东亚、苏峥、从群基领导；海问团队由合伙人高巍、徐启飞牵头。

成本次发行上市的独家保荐人为中国国际金融股份有限公司。

KWM, Haiwen led on Nexchip’s listing on STAR Market

King & Wood Mallesons has advised Nexchip Semiconductor Corporation (Nexchip) on its $1.4 billion IPO on Shanghai’s STAR Market, with Haiwen & Partners advising the sole sponsor.

Established in 2015, Nexchip operates integrated circuit production business, manufacturing 12 inch wafers and other products.

The KWM’s team was led by partner Liu Dongya, Suzheng, Cong Qunji; The Haiwen’s team was led by partners Gao Wei, Xu Qifei.

The sole sponsor in this project is CICC.